الفهرس 
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Abstract
The heat pipe is a device capable of transferring high rates of heat
under isothermal conditions. Recently, the thermal load of electronic
devices are increasing, so an improvement of their heat radiation
characteristics is longed for. A solution for this will be contacting the
electronic device with a heat sink; a flat shaped heat pipe, thereby
effectively diffusing the heat from the electronic device. It is effective as a
heat radiation means for electronic devices employed in an artificial
satellite or under other space environments. The procedure to design such
a heat pipe for this specific application requires the consideration of
operation limits. Therefore, the present study concentrates on studying the
performance limits of flat plate heat pipe. The heat pipe consists of a
circular container, whose interior wall is lined with wrapped screens wick
structure saturated with the working fluid. Heat transfer from the
evaporator plate (constant heat flux) causes the liquid in the wick to
evaporate and flow to the condensing plate where it is condensed. In this
type of heat pipes (flat plate), there is no adiabatic section. The return of
liquid from the condenser to the evaporator occurs due to the capillary
forces in the wick that create a surface tension pressure differential to
overcome the vapor and liquid pressure DROPs, including that due to
gravity.
As in conventional cylindrical heat pipe, the heat transfer capability
of the flat plate heat pipe can be limited by sonic flow of vapor, viscous,
entrainment, capillary (wicking) and boiling limits. These limits are
strongly depend on the geometry of the pipe, wick structure, vapor channel