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Abstract Based on results of this study, and despite of the limitation of small sample size, it seems reasonable to conclude that : 1. Bonding of universal adhesives to ground enamel provided better microtensile bond strength compared to unground enamel except Prime Bond Universal. 2. Using of universal adhesives in etch-and-rinse mode revealed higher microtensile bond strength compared to self-etch mode either with unground or ground enamel except G-permio bond. 3. Water storage negatively affected the microtensile bond strength of universal adhesives applied to unground and ground enamel either in etch-and-rinse or self-etch modes except One coat 7. |